Monday, May 19, 2008

Motorola Lead-Free Repair Procedures

Underfill Rework Process
Open/peel off the shield cover, put the board on the repair fixture, use hot gun to heat the BGA, remove BGA when the solder melted.
Apply flux to the pads of the board, and clean the BGA area with electric iron!

Repair_Soldering_Procedures
Download-Link #1: http://rapidshare.com/files/10688621...dures.rar.html

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